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Allison doc Crack Version 12. Free Download For PC Win All.Conventional integrated circuits are typically manufactured using a sequence of lithography operations that transfers patterns onto a substrate. A lithography operation typically includes the following steps: (a) applying a layer of resist over the surface of the substrate, (b) patterning this layer of resist to form a mask, (c) etching material on the surface of the substrate to transfer a mask pattern into the substrate, and (d) removing the remaining resist.
More specifically, FIG. 1 shows a conventional single-mask process for transferring pattern 10 into substrate 12. FIG. 2 shows the patterned resist layers 14 after development. Pattern 10 is transferred into substrate 12 by etching material underneath resist layers 14. Following this process, resist layers 14 must be stripped, which is a time-consuming process.
As an alternative, double-mask process for transferring pattern 14 into substrate 12 is shown in FIG. 3. In double-mask process, resist layers 30 and 34 are applied to substrate 16 and 32, respectively. The second mask is formed by exposing and developing resist layer 34 in a pattern corresponding to the first mask, and resist layer 30 is exposed and developed to form a pattern corresponding to the second mask. Next, resist layers 30 and 34 are stripped, and substrate 16 is etched to transfer pattern 14 into substrate 12. Because the first and second masks are made using conventional lithography, double-mask process avoids the expense associated with stripping the masks. However, the conventional double-mask process still incurs an appreciable amount of delay.
Recently, techniques have been developed that chemically etch a layer to form a mask without using conventional lithography techniques. For example, U.S. Pat. No. 6,555,864 to Sorenson et al. titled “Maskless Direct-Write Lithography” describes a process for creating a mask for etching a layer by dipping the substrate into an etchant in a closed
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