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Welcome to TinyWarrior, the database of nude, sexy and provocative adult creatures.1. Field of the Invention
The present invention relates to a thick film potting composition, a manufacturing method of an integrated circuit substrate in which an integrated circuit and a thick film circuit are integrated, and an integrated circuit substrate manufactured by the method.
2. Description of the Related Art
A process for integrating an integrated circuit and a thick film circuit on a substrate such as a glass substrate, a silicon substrate, and a ceramic substrate has been known. However, such a process has disadvantages in that it requires complicated steps and is inconvenient because of its low yield.
Therefore, an object of the present invention is to provide a thick film potting composition which is suited for forming a thick film circuit and can be more readily integrated with a substrate, a method of manufacturing an integrated circuit substrate in which an integrated circuit and a thick film circuit are integrated, and an integrated circuit substrate.
In one aspect of the present invention, the above object is attained by providing a thick film potting composition which comprises (A) a resin component comprising a resin having a 5% weight loss temperature of 150xc2x0 C. or lower, the resin being decomposed in an atmosphere having a 5% weight loss temperature of 150xc2x0 C. or lower or a nitrogen atmosphere; (B) a glass component comprising a glass having a softening point of 550xc2x0 C. or lower and a 5% weight loss temperature of 150xc2x0 C. or lower; and (C) a filler, wherein the content of the filler is 5% by weight or less relative to the total weight of the resin component and the glass component.
Further, in another aspect of the present invention, the above object is attained by providing a method of manufacturing an integrated circuit substrate which comprises a process of forming a thick film circuit on a surface of a substrate and a process of forming an integrated circuit on the surface of the substrate, the method of manufacturing the integrated circuit substrate comprising the steps of:
preparing a thick film potting composition which comprises (A) a resin component comprising a resin having a 5% weight loss temperature of 150xc2x0 C. or
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